Highlights

  • Latest System on Module form factor
  • Up to 4x Cortex-A53, 1x Cortex-M4/M7
  • NXP® i.MX 8M Mini and i.MX 8M Nano applications processor
  • Armv8 64-Bit CPU cores
  • On-board dual-band 802.11ac 2x2 MU-MIMO Wi-Fi and Bluetooth 5
  • Supported by open-source Torizon Linux Operating System
  • Power- and cost-optimized
Designed in Switzerland. Made in Germany.
Verdin iMX8M Mini
Arm CPU Cortex-A53+ Cortex-A72+ M4
wifi 802 11 ac and bluetooth 5 ready logo
Verdin iMX8M Nano (Build to order)
Arm CPU Cortex-A53+ Cortex-A72+ M4
wifi 802 11 ac and bluetooth 5 ready logo

Perfect Balance between Performance, Power, and Cost

The Verdin iMX8M Mini and Verdin iMX8M Nano SoMs provide up to four powerful Arm 64 bit Cortex-A53 cores. The performance offered by these modules makes them an ideal choice for running modern Linux operating systems with graphical user interface while still providing sufficient power reserves for serving typical industrial and medical applications. Large RAM and Flash Memory capacities meet the requirements of all modern embedded applications.

  • OpenCL
  • OpenGL ES

Power Optimized

The NXP i.MX 8M Mini and Nano SoCs are manufactured using the low power 14LPC FinFET Technology. The new Verdin form factor standard provides a new, simple and straightforward solution for extending power optimization from the SoC to the System on Module and further to the complete system. This holistic approach gives customers granular control over the power consumption of the peripherals available on their carrier boards.

The M4/M7 cores allow for further optimization whenever a connected standby mode is required. The main (A53) cores can be switched off and the microcontroller core can continue running the most crucial pieces of code.

Wide range of Modern and Future-proof Interfaces

The modules provide modern interfaces such as Gigabit Ethernet, MIPI CSI Camera, MIPI DSI Display, PCIe, Quad SPI, CAN, among many others. 1.8V I/O voltage level guarantees future proofness and supports power- and cost-optimized designs. A simple pinout concept and our popular *Pinout Designer tool contribute to delivering a simple and rewarding carrier board design experience.

Heterogeneous Multicore Processing (HMP) for Hard Real-time

The Cortex M4/M7 cores can be used to offload critical real-time tasks from the main operating system to reach extremely low latencies and reproducible real-time behaviour. Typically, FreeRTOS or another real-time operating system is used on the Cortex-M cores. Toradex provides tooling to make the development and integration of the M cores as easy as possible.

High-performance On-board Dual-band Wi-Fi and Bluetooth Options

Simplify your design with certified wireless options. The latest 802.11ac standard and support for multi-antenna setups contribute to a nice out-of-the-box end-user experience. Certified Wi-Fi antennas increase the predictability of end-device certification processes – while enabling significant cost savings.

Ruggedness, Reliability

The module comes with environmental test reports for vibration, EMI/EMC to give you peace of mind. Highly reliable embedded eMMC flash memory is used and tools such as the Toradex Flash Analytics tool allow you to monitor your flash wear in a very simple manner.

Available Configurations

This Verdin module is available in two configurations. The off-the-shelf version will feature the i.MX 8M Mini SoC. Another version featuring the i.MX 8M Nano SoC will be available as a Build-to-Order (BTO) option.

The i.MX 8M Mini features faster A53 cores and double the RAM bandwidth, more I/Os (such as PCIe) and more USB ports, and comes with hardware accelerated video encoding and decoding (including H.265 decoding) capabilities.

The i.MX 8M Nano is lacking video encoding and decoding capabilities but offers a faster Cortex-M7 core instead of the M4 and features a stronger GPU with OpenCL 1.2 capability.

*Pinout Designer support for Verdin iMX8M Mini SoM coming soon

Get Updates


Simplify Modern Product Development with the Verdin iMX8M Mini and Nano SoMs

 

First look at the Verdin System on Module

Toradex offers free support and maintenance for Embedded Linux and FreeRTOS on the NXP® i.MX 8M Mini/Nano processor based Verdin iMX8M SoMs. This allows system designers to focus the application only, instead of focusing also on the OS and low-level device drivers. Other OS such as Android and QNX are supported by our partners.

 

Linux

Toradex Easy Installer

Toradex Verdin iMX8M modules come with the pre-installed Toradex Easy Installer which offers an easy one-click installation of Toradex Embedded Linux BSPs and Partner Demo Images.

For general information about the advantages and features, check our Toradex Easy Installer page.

Get Started


Torizon

Torizon

Torizon is a new Linux-based software platform that simplifies the process of developing and maintaining embedded software. It allows you to configure the system for your use case quickly and easily, so you can focus on application development instead of Linux builds.

For general information about the advantages and features, check our Torizon page.

Get Started


Linux

Embedded Linux

Toradex carries out in-house development and maintenance of a Yocto project-compatible production-quality Embedded Linux BSP. Our extensive documentation and support makes sure your product reaches market in time. Full source code and Toradex developments are up-streamed into mainline.

For general information about the advantages and features, check our Embedded Linux page.

Get Started


QNX

QNX

A QNX Evaluation Image will be provided directly from QNX.

Get Updates


FreeRTOS

FreeRTOS

FreeRTOS on Verdin iMX8M is supported directly by Toradex. It is a real-time OS that runs on the Cortex-M4 cores in parallel to the main OS.

For general information, check our FreeRTOS page.

Coming Soon


Android

Android

An Evaluation will be provided free of charge as a binary installer directly on Toradex Easy Installer feeds and in source-code.

Get Updates


 
 
CPU Details
CPU Name
CPU Type
Microcontroller
CPU Clock
Floating Point Unit
NEON
L1 Instruction Cache
L1 Data Cache
L2 Cache
Memory
RAM
Flash
Connectivity
USB 2.0
Ethernet
Wi-Fi
Bluetooth
PCIe
I2C
SPI
QSPI
UART
PWM
GPIO
Analog Input
SDIO/SD/MMC
CAN
JTAG
Security
Secure Element
Multimedia
Display Controller
Graphics Controller
Video Decoder
Video Encoder
Display Serial Interface
LVDS
Digital Audio
S/PDIF In / Out
2D Acceleration
3D Acceleration
HDMI
Camera Serial Interface
Operating System
Torizon
Embedded Linux
Preinstalled OS
Android
QNX
FreeRTOS
Physical
Size
Temperature
Shock / Vibration
Power Dissipation
Minimum Product Commitment
Verdin iMX8M Mini Quad 2GB Wi-Fi / Bluetooth
Industrial Temperature (IT)
Verdin iMX8M Mini DualLite 1GBShare your Ideal Configuration
We will use your input to decide on future product configurations. If you are interested in built-to-order modules, see our developer page article
Buy Now Buy NowShare your Ideal Configuration
 
NXP® i.MX 8M Mini QuadNXP® i.MX 8M Mini DualLite
4x Arm Cortex™-A532x Arm Cortex™-A53
1x Arm Cortex™-M4F1x Arm Cortex™-M4F
1.6 GHz (A53)
400 MHz (M4F)
1.8 GHz (A53)
400 MHz (M4F)
VFPv4VFPv4
YesYes
32KB (A53)
16KB (M4F)
32KB (A53)
16KB (M4F)
32KB (A53)
16KB (M4F)
32KB (A53)
16KB (M4F)
512KB512KB
 
2GB LPDDR4 (32-bit)1GB LPDDR4 (32bit)
16GB eMMC (8bit)8GB eMMC (8bit)
 
1x Host / 1x OTG1x Host / 1x OTG
Gigabit with AVBGigabit with AVB
Dual-band 802.11 ac/a/b/g/n 2x2 MU-MIMO
Bluetooth 5 ready
1x Single Lane Gen 21x Single Lane Gen 2
3x3x
2x2x
1x2x
4x4x
4x4x
Up to 84xUp to 109x
4x4x
1x2x
1x
1x1x
 
NXP® EdgeLock™ SE050 (experimental)
 
SingleSingle
2D: Vivante GC320
3D: Vivante GCNanoUltra
2D: Vivante GC320
3D: Vivante GCNanoUltra
Yes
Yes
1x Quad Lane MIPI DSI1x Quad Lane MIPI DSI
Via AdapterVia Adapter
4x SAI: I2S or AC974x SAI: I2S or AC97
1x / 1x1x / 1x
YesYes
YesYes
Via AdapterVia Adapter
1x Quad Lane MIPI CSI-21x Quad Lane MIPI CSI-2
 
SupportedSupported
SupportedSupported
Toradex Easy InstallerToradex Easy Installer
Supported by third partySupported by third party
Supported by third partySupported by third party
Coming SoonComing Soon
 
69.6 x 35.00 x 6.0 mm69.6 x 35.00 x 6.0 mm
-40° to +85° C(1)0° to +70° C
EN 60068-2-6/50g 20msEN 60068-2-6/50g 20ms
TBDTBD
2030+2030+
(1)The Wi-Fi component on the module is limited to an operating temperature range of -30° to +85°C. As this component is not deemed boot-critical, the Verdin iMX8M Mini 2GB WB IT is still listed as an Industrial Temperature product.
  Verdin Development BoardDahlia Carrier Board
Verdin Development BoardDahlia Carrier Board
DatasheetDatasheet - Contact Us
detail...detail...
Connectivity   
USB 3.02x USB-A (Host)2x USB-A (Host)
USB 2.01x USB Micro-B (OTG)1x USB-C (DualRole)
USB 2.0 Debug1x USB Micro-B1x USB-C
Ethernet2x Gigabit1x Gigabit
PCIe1x (Mini PCIe)1x (Mini PCIe)
I2C4x3x
SPI1x1x
QSPI1x1x
UART4x4x
PWM3x3x
GPIOUp to 109xUp to 47x
Analog Input4x4x
RS2321x
RS4851x
SDIO/SD/MMC1x 4 Bit (Full Size)1x 4 Bit (microSD)
CAN2x1x
Type-specific Extension ConnectorYes
Multimedia   
Display Serial Interface1x Quad Lane MIPI DSI1x Quad Lane MIPI DSI
Digital Audio1x I2S
S/PDIF In / Out1x
HDMI1x1x (via included DSI to HDMI Adapter)
Camera Serial Interface1x Quad Lane MIPI CSI-21x Quad Lane MIPI CSI-2
Analog Audio Line in1x (Stereo)1x (Stereo)
Analog Audio Mic in1x (Stereo)1x (Mono)
Analog Audio Headphone out1x (Stereo)1x (Stereo)
Physical   
Supply Voltage6-27V DC5-27V DC or USB-C (PD and BC)
Size250mm x 200mm120mm x 120mm
Temperature0° to 70 °C0° to 70 °C
2 Modules, 2 Carrier Boards

NXP® i.MX 8M Mini Quad, 4x Arm Cortex™-A53, 1.6 GHz (A53), 400 MHz (M4F), 2GB LPDDR4 (32-bit), 16GB eMMC (8bit), Gigabit with AVB Ethernet, -40° to +85° C(1) Temp. Range, Availability until 2030+

(1)The Wi-Fi component on the module is limited to an operating temperature range of -30° to +85°C. As this component is not deemed boot-critical, the Verdin iMX8M Mini 2GB WB IT is still listed as an Industrial Temperature product.

coming soon

In Development

NXP® i.MX 8M Mini DualLite, 2x Arm Cortex™-A53, 1.8 GHz (A53), 400 MHz (M4F), 1GB LPDDR4 (32bit), 8GB eMMC (8bit), Gigabit with AVB Ethernet, 0° to +70° C Temp. Range, Availability until 2030+

 

coming soon

In Development

Connectivity: USB 3.0: 2x USB-A (Host), USB 2.0: 1x USB Micro-B (OTG), 2x Gigabit Ethernet, 4x I2C, 1x SPI, 3x PWM, 4x ADC, 2x CAN, Up to 109x GPIOs

Multimedia: Audio out: 1x (Stereo), Audio in: 1x (Stereo), 1x S/PDIF In / Out.

Physical: 6-27V DC Supply Voltage, Size: 250mm x 200mm

 

coming soon

In Development

Connectivity: USB 3.0: 2x USB-A (Host), USB 2.0: 1x USB-C (DualRole), 1x Gigabit Ethernet, 3x I2C, 1x SPI, 3x PWM, 4x ADC, 1x CAN, Up to 47x GPIOs

Multimedia: Audio out: 1x (Stereo), Audio in: 1x (Stereo).

Physical: 5-27V DC or USB-C (PD and BC) Supply Voltage, Size: 120mm x 120mm

 

coming soon